- Material name
- TG
- Product Overview
- application area
- More details
-
Y-303HS260℃High Tg ,Low CTE, Low Df Lamina te&Prepreg for IC P ackagesSubstrates for SLP、SIP、AIP、CSP、FC-PKG etc.View moreHigh Tg ,Low CTE, Low Df Lamina te&Prepreg for IC P ackagesSubstrates for SLP、SIP、AIP、CSP、FC-PKG etc.
- Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
- High modulus,
- Excellent heat resistance
- Halogen-free and Tg260℃
- Excellent uniformity of thickness
- Low Dk & Df
Property
Item
IPC-TM-650
Test
Condition
Units
Typical value
Y-303HS
(E-glass)
Y-303HS(LD)
(NE-glass)
Thermal
Glass Transition Temperature
2.4.24.4
DMA
℃
260-280
2.4.24.5
TMA
℃
230-260
X,Y-CTE
2.4.24.5
＜Tg
ppm/℃
8~10
8~10
＞Tg
ppm/℃
3
3
T288
2.4.24.1
Etched
min
＞60
＞60
Thermal stress
2.6.8
288℃，solder dip
S
＞300
＞300
(weight loss 5%)
Decomposition temperature
2.4.24.6
TGA
℃
398
402
Electrical
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ-cm
＞108
＞10^8
Surface Resistivity
2.5.17.1
C-96/35/90
MΩ
＞108
＞10^8
Dk（RC50%70%）
2.5.5.9
1GHz;C-24/23/50
-
3.8/3.3
3.4/3.2
10GHz;C-24/23/50
3.6/3.2
3.2/3.0
Df（RC50%70%）
2.5.5.9
1GHz;C-24/23/50
-
0.004/0.003
0.002/0.002
10GHz;C-24/23/50
0.005/0.004
0.003/0.003
Physical
Flexural Strength
LW
CW
2.4.4
A
MPa
520
480
520
480
Flexural modulus
JB/T 6544-1993
A
GPa
22~25
22~25
Young’s Modulus
GB/T 2015-91
A
GPa
23
23
Peel Strength
（Hoz Copper Foil）
2.4.8
288℃/10s
lb/inch
3.0
3.0
Thermal conductivity
ASTM-D5470
C-96/35/90
W/(m*k)
0.7
0.7
Moisture Absorption
2.6.2.1
D-24/23
%
0.04
0.04
-
Y-209HS300℃High Tg, Ultralow CTE Laminate&Prepreg for IC PackagesSubstrates for CSP 、SIP、BGA、FC- PKG etcView moreHigh Tg, Ultralow CTE Laminate&Prepreg for IC PackagesSubstrates for CSP 、SIP、BGA、FC- PKG etc
- Ultralow CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
- High modulus,
- Halogen-free and Tg 300℃
- Excellent uniformity of thickness
- Excellent heat resistance
Property
Item
IPC-TM-650
TestCondition
Units
Typicalvalue
Y-209HS
E-glass
Y-209HS
（L&LC）
T-glass
Thermal
GlassTransition
Temperature
2.4.24.4
DMA
℃
300
310
2.4.24.5
TMA
℃
270
280
X,Y-CTE
＜Tg
ppm/℃
5
3
＞Tg
ppm/℃
3
2
T288
＞60
＞60
Thermal stress
2.6.8
288℃，solderdip
S
＞300
＞300
Decomposition temperature
℃
Volume Resistivity
C-96/35/90
＞108
＞10^8
Surface Resistivity
＞108
＞10^8
Dk(RC50%)
Df(RC50%)
2.5.5.9
1GHz;C-24/23/50
0.008
0.007
Flexural Strength
LW
CW
2.4.4
A
MPa
500
500
Flexural modulus
Physical
Young’s Modulus
GB/T2015-91
Peel Strength
(Hoz Copper Foil)
2.4.8
288℃/10s
lb/inch
5.0
Thermal conductivity
Moisture Absorption
D-24/23
%
Flammability
-
Y-208HS260℃High Tg, Low CTE Laminate&Prepreg for IC PackagesSubstrates for CSP 、BGA 、FC- PKG etc.View moreHigh Tg, Low CTE Laminate&Prepreg for IC PackagesSubstrates for CSP 、BGA 、FC- PKG etc.
- Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
- High modulus
- Excellent heat resistance
- Halogen-free and Tg 260℃
- Excellent uniformity of thickness
Property
Item
IPC-TM-650
TestCondition
Units
Typicalvalue
Y-208HS
(E-glass)
Y-208HS
（L&LC）
(T-glass)
Thermal
Glass Transition
Temperature
2.4.24.4
DMA
℃
260
260
2.4.24.5
TMA
℃
230
230
X,Y-CTE
＜Tg
ppm/℃
9
6
＞Tg
ppm/℃
3
3
T288
2.4.24.1
Etched
min
＞60
＞60
Thermal stress
2.6.8
288℃ ，solder dip
S
＞300
＞300
(weight loss 5%) Decomposition temperature
2.4.24.6
TGA
℃
398
400
Electrical
Volume Resistivity
2.5.17.1
C-96/35/90
＞108
＞10^8
Surface Resistivity
2.5.17.1
C-96/35/90
＞108
＞10^8
Dk(RC50%)
2.5.5.9
1GHz;C-24/23/50
4.3
4.3
Df(RC50%)
2.5.5.9
1GHz;C-24/23/50
0.008
0.008
Physical
Flexural Strength
LW
CW
2.4.4
A
MPa
520
480
550
500
Flexural modulus
JB/T 6544- 1993
A
GPa
30
33
Physical
Young’s Modulus
GB/T2015-91
A
Peel Strength
( Hoz Copper Foil)
2.4.8
288℃/10s
lb/inch
5.5
5.5
Thermal conductivity
ASTM-D5470
C-96/35/90
W/(m*k)
Moisture Absorption
2.6.2.1
D-24/23
%
Flammability
UL94
UL94
-
-
Y-207HS230℃High Tg, Low CTE Laminate&Prepreg for IC PackagesSubstrates for CSP 、 BGA 、 FC- PKG etView moreHigh Tg, Low CTE Laminate&Prepreg for IC PackagesSubstrates for CSP 、 BGA 、 FC- PKG et
- Low CTE and low shrinkage, effective to reduced the warpage of substrate for IC PKG
- High modulus
- Excellent heat resistance
- Halogen-free and Tg 230℃
- Excellent uniformity of thickness
Property
Item
IPC-TM-650
TestCondition
Units
Typical value
Y-207HS
(E-glass fabric)
Y-207HS(LD)
(NE-glass fabric)
Thermal
Glass Transition
Temperature
2.4.24.4
DMA
℃
230
240
2.4.24.5
TMA
℃
210
220
X,Y-CTE
2.4.24.5
＜Tg
ppm/℃
10~ 12
10~12
＞Tg
ppm/℃
4 ~ 7
4~7
2T288
Etched
min
＞60
＞60
Thermal stress
288℃ ，solder dip
＞300
＞300
(weight loss 5%) Decomposition temperature
2.4.24.6
TGA
℃
Volume Resistivity
C-96/35/90
＞108
＞10^8
Surface Resistivity
C-96/35/90
MΩ
＞108
＞10^8
Dk(RC50%)
1GHz;C-24/23/50
-
4.5
3.9/3.5
Df(RC50%)
2.5.5.9
1GHz;C-24/23/50
-
0.008
0.005/0.006
Flexural Strength
LW
CW
2.4.4
A
MPa
500
460
500
460
Flexural modulus
JB/T 6544- 1993
A
GPa
30
31
Physical
Young’s Modulus
GB/T2015-91
A
GPa
28
29
Peel Strength
( Hoz Copper Foil)
2.4.8
288℃/10s
lb/inch
5.8
5.5
Thermal conductivity
ASTM-D5470
C-96/35/90
W/(m*k)
0.68
0.70
Moisture Absorption
2.6.2.1
D-24/23
%
0. 1
0.1
Flammability
UL94
UL94
-
V-0
V-0
-
Y-206BSR200℃Blck, Low CTE, High modulus Laminate&Prepreg for IC PackagesSubstrates for CSP 、BGA 、FC- PKG etc.View moreBlck, Low CTE, High modulus Laminate&Prepreg for IC PackagesSubstrates for CSP 、BGA 、FC- PKG etc.
- Halogen Free and Tg 200℃(DMA)
- Low CTE and low shrinkage
- High modulus
- Black and good light blocking
- Excellent heat resistance
- Excellent dimensional stability
- Excellent uniformity of thickness
Property
Item
IPC-TM-650
Test Condition
Units
Typical value
Thermal
Glass Transition Temperature
2.4.24.4
DMA
℃
200
X,Y-CTE
2.4.24.5
TMA
ppm/℃
9 ~12
Z axis-CTE
2.4.24
TMA，Before TG
ppm/℃
28
TMA，After TG
ppm/℃
198
50 ~ 260℃
%
2.0
T288
Clad
min
＞60
Etched
min
＞60
Thermal stress
288℃ ，solder dip
＞300
Decomposition temperature
2.4.24.6
TGA
℃
385
Electrical
Volume Resistivity
C-96/35/90
＞10^8
Surface Resistivity
C-96/35/90
＞10^8
Dk(RC50%)
1GHz;C-24/23/50
/
Df(RC50%)
2.5.5.9
1GHz;C-24/23/50
/
0.020
Red light permeability
/
Internal standard
%
0
Flexural Strength
LW
CW
590
520
Flexural modulus
JB/T 6544- 1993
Young’s Modulus
GB/T 22315-2008
A
GPa
28
Peel Strength
(Hoz Copper Foil)
2.4.8
288℃/10s
lb/inch
5.0
Thermal conductivity
C-96/35/90
W/(m*k)
Moisture Absorption
2.6.2.1
D-24/23
%
0.13
Specimen thickness：0.40mmor 0.80mm.
Test Method is according to I PCTM-650 . The data above is only for reference, and the actual data will have deviation, according to varieties of test equipment and method.
-
Y-206BSM185℃Black, Low CTE, High modulus Laminate&Prepreg for ICPackagesSubstrates for CSP、BGA、FC-PKG etc.View moreBlack, Low CTE, High modulus Laminate&Prepreg for ICPackagesSubstrates for CSP、BGA、FC-PKG etc.
- Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
- High modulus,
- Excellent heat resistance
- Halogen-free and Tg 185℃
- Black and good light blocking
- Excellent uniformity of thickness
Property
Item
IPC-TM-650
Test Condition
Units
Typical value
Glass Transition Temperature
℃
185
X,Y-CTE
ppm/℃
9~ 12
Z axis-CTE
TMA，Before TG
ppm/℃
35
TMA，After TG
ppm/℃
195
50 ~ 260℃
%
2.2
T288
2.4.24.1
Clad
min
＞60
Etched
min
＞60
Thermal stress
288℃ ，solder dip
＞300
Decomposition temperature
℃
380
Electrical
Volume Resistivity
C-96/35/90
＞10^10
Surface Resistivity
C-96/35/90
＞10^10
Electrical
Dk(RC50%)
1GHz;C-24/23/50
/
Df(RC50%)
2.5.5.9
1GHz;C-24/23/50
/
0.019
Red light permeability
/
Internal standard
%
0
Flexural Strength
LW
CW
2.4.4
A
MPa
560
510
Flexural modulus
JB/T 6544- 1993
A
29
Young’s Modulus
A
GPa
29
Peel Strength
(Hoz Copper Foil)
2.4.8
288℃/10s
Thermal conductivity
ASTM-D5470
C-96/35/90
W/(m*k)
Moisture Absorption
2.6.2.1
D-24/23
%
-
Y-201TSR200℃High Tg, White Laminate for package substrates &PrepregSmallspace/Mini/MicroLED,Package substrate , VCR .etcView moreHigh Tg, White Laminate for package substrates &PrepregSmallspace/Mini/MicroLED,Package substrate , VCR .etc
- Halogen Free and Tg 200℃(DMA)
- High whiteness and high reflectivity
- Excellent yellowing resistance
- Thickness uniformity control technology
- Lead free process compatible
- Excellent dimensional stability
- Low Z-axis CTE and excellent through hole reliability
Property
Item
IPC-TM-650
Test Condition
Units
Typical value
Thermal
Glass Transition Temperature
2.4.24.4
DMA
℃
200
X,Y-CTE
2.4.24.5
TMA
ppm/℃
9 ~10
Z axis-CTE
2.4.24
TMA， Before TG
ppm/℃
46
TMA，After TG
ppm/℃
196
50 ~ 260℃
%
2.2
Etched
min
＞60
Thermal stress
288℃ ,solder dip
＞300
(weight loss 5%) Decomposition temperature
2.4.24.6
TGA
℃
380
Electrical
Volume Resistivity
C-96/35/90
MΩ-cm
＞108
Surface Resistivity
C-96/35/90
＞108
Dk(RC50%)
1GHz;C-24/23/50
/
Df(RC50%)
2.5.5.9
1GHz;C-24/23/50
/
0.013
Physical
Whiteness
Internal standard
%
90
Reflectance rate
Internal standard
%
92.5
Flexural Strength
LW
CW
M Pa
550
490
Flexura modulus
Young’s modulus
JB/T 6544- 1993
G Pa
26
Peel Strength
(Hoz Copper Foil)
2.4.8
288℃/10s
lb/inch
5.5
Thermal conductivity
C-96/35/90
W/(m*k)
0.7
Moisture Absorption
D-24/23
%
0. 13
-
Y-201TS185℃High Tg, White Laminate for package substrates &PrepregSmallspace/Mini/MicroLED,Package substrate , VCR .etcView moreHigh Tg, White Laminate for package substrates &PrepregSmallspace/Mini/MicroLED,Package substrate , VCR .etc
- Halogen Free and Tg 185℃(DMA)
- High whiteness and high reflectivity
- Excellent yellowing resistance
- Thickness uniformity control technology
- Lead free process compatible
- Excellent dimensional stability
- Low Z-axis CTE and excellent through hole reliability
Property
Item
IPC-TM-650
Test Condition
Units
Typical value
Glass Transition Temperature
2.4.24.4
℃
185
X,Y-CTE
TMA
ppm/℃
10 ~12
TMA，Before TG
ppm/℃
48
TMA，After TG
ppm/℃
202
50 ~ 260℃
%
2.6
Etched
min
＞60
Thermal stress
2.6.8
＞300
Decomposition temperature
2.4.24.6
℃
Volume Resistivity
＞10^8
Surface Resistivity
＞10^8
Dk(RC50%)
1GHz;C-24/23/50
/
5.6
Df (RC50%)
2.5.5.9
1GHz;C-24/23/50
/
0.018
Whiteness
Internal standard
%
90
Reflectance rate
Internal standard
%
Flexural Strength
LW
CW
2.4.4
A
MPa
560
530
Flexura modulus
Young’s modulus
JB/T 6544- 1993
Peel Strength
(Hoz Copper Foil)
2.4.8
288℃/10s
lb/inch
5.7
Flammability
/
CTI
级别
Thermal conductivity
ASTM-D5470
C-96/35/90
W/(m*k)
0.7
CAF
---
85℃/85%/50V
Hours
>1000
Moisture Absorption
2.6.2.1
D-24/23
%
-
H-870G180℃High Tg, White Laminate for Package Substrate&PrepregCOB、LED CMOS .etcView moreHigh Tg, White Laminate for Package Substrate&PrepregCOB、LED CMOS .etc
- Halogen Free and Tg180℃（DMA）
- High whiteness and high reflectivity
- Excellent yellowing resistance
- Thickness uniformity control technology
- Lead free process compatible
- Low Z-axis CTE and excellent through hole reliability
Property
Item
IPC-TM-650
Test Condition
Units
Typical value
Thermal
Glass Transition Temperature
2.4.24
DMA
℃
190
X,Y-CTE
2.4.24.5
TMA
ppm/℃
11～14
Z axis-CTE
2.4.24
TMA，Before TG
ppm/℃
48
TMA，After TG
ppm/℃
202
50～260℃
%
2.6
T288
2.4.24.1
Clad
min
＞60
Etched
min
＞60
Thermal stress
2.6.8
288℃，solder dip
S
＞300
Decomposition temperature
2.4.24.6
TGA
℃
380
Electrical
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ-cm
＞10^8
Surface Resistivity
2.5.17.1
C-96/35/90
MΩ
＞10^8
Physical
Whiteness
GB2911982
Internal standard
%
88
Reflectance rate
GJB 5023.1-2003
Internal standard
%
90
Flexural Strength
LW
CW
2.4.4
A
MPa
490
460
Young’s modulus
JB/T 6544-1993
A
GPa
21
Peel Strength
（Hoz Copper Foil）
2.4.8
288℃/10s
lb/inch
5.7
Flammability
UL94
UL94
/
HB
CTI
IEC-112
IEC-112
level
0
Moisture Absorption
2.6.2.1
D-24/23
%
0.13
- Material name
- TG
- Product Overview
- application area
- More details
-
HBF-Z01190℃High reliability , Low CTE, high modules Build-up film for IC PackagesFor HDI 、FC-PKG、ECP、SLP、SIP etc.View moreHigh reliability , Low CTE, high modules Build-up film for IC PackagesFor HDI 、FC-PKG、ECP、SLP、SIP etc.
- Low CTE and low shrinkage
- Low elastic modulus
- Excellent heat resistance
- Halogen-free
- Excellent uniformity of thickness
- Excellent resin flow and filling property
Materials
HBF-Z01
(PET / RCC)X- CTE
30~150℃
20
150~240℃
65
Y- CTE
30~150℃
20
150~240℃
65
Dk
1 G Hz
3.3
Df
1 G Hz
0.0065
Tg
TMA
175.0
DMA
190.0
Young's modulus
Room temp.
G Pa
10.8
Tensile strength
Room temp.
MPa
120~140
Peel strength
Ra<0.30 um
Rz<2.0 um12um
0.6~0.8
Elongation
Room temp.
%
2.0
Water Absorption
(PCT-2hrs/121°C)
wt%
0.35
B-HAST 30um thickness
（130°C/85%/5.5V)
Hours
>200
B-HAST
L/S 30/20um（130°C/85%/5.5V)
Hours
>200
-
HBF-X01170℃High reliability , Low CTE, high modules Build-up film for IC PackagesFor HDI 、FC-PKG、ECP、SLP、SIP etc.View moreHigh reliability , Low CTE, high modules Build-up film for IC PackagesFor HDI 、FC-PKG、ECP、SLP、SIP etc.
- Low CTE and low shrinkage,
- Low elastic modulus,
- Excellent heat resistance
- Halogen-free
- Excellent uniformity of thickness
- Excellent resin flow and filling property
Materials
HBF-X01
(PET / RCC)X- CTE
30~150℃
30
150~240℃
80
Y- CTE
30~150℃
30
150~240℃
80
Dk
1 G Hz
3.4
Df
1 G Hz
0.0110
Tg
TMA
155.0
DMA
170.0
Young's modulus
Room temp.
G Pa
10.8
Tensile strength
Room temp.
MPa
120~140
Peel strength
Ra<0.30 um
Rz<2.0 um12um
0.6~0.8
Elongation
Room temp.
%
2.0
Water Absorption
(PCT-2hrs/121°C)
wt%
0.35
B-HAST 30um thickness
（130°C/85%/5.5V)
Hours
>200
B-HAST
L/S 30/20um（130°C/85%/5.5V)
Hours
>200
-
HBF-G92170℃High reliability , Low CTE, high modules Build-up film for IC PackagesFor HDI 、FC-PKG、ECP、SLP、SIP etc.View moreHigh reliability , Low CTE, high modules Build-up film for IC PackagesFor HDI 、FC-PKG、ECP、SLP、SIP etc.
- Low elastic modulus
- Excellent heat resistance
- Halogen-free, Hi-Tg
- Excellent uniformity of thickness
- Excellent resin flow and filling property
Materials
HBF-G92
(PET / RCC)X- CTE
30~150℃
30~40
150~240℃
110~130
Y- CTE
30~150℃
30~40
150~240℃
110~130
Dk
1 G Hz
3.2
Df
1 G Hz
0.016
Tg
TMA
155.0
DMA
170.0
Young's modulus
Room temp.
G Pa
10.8
Tensile strength
Room temp.
MPa
120~140
Peel strength
Ra<0.30 um
Rz<2.0 um12um
0.6~0.8
Elongation
Room temp.
%
2.0
Water Absorption
(PCT-2hrs/121°C)
wt%
0.35
B-HAST 30um thickness
（130°C/85%/5.5V)
Hours
>200
B-HAST
L/S 30/20um（130°C/85%/5.5V)
Hours
>200
- Material name
- TG
- Product Overview
- application area
- More details
-
Y-920GT140℃High Light Transmittance LaminateDisplay screenView moreHigh Light Transmittance LaminateDisplay screen
- Halogen Free and High light transmittance
- High machine strength
- Excellent mechanical processability
Property
Item
IPC-TM-650/GB
Test Condition
Units
Typical value
Thermal
Glass Transition Temperature
2.4.24.4
DSC
℃
140
Decomposition temperature
2.4.24.6
TGA
℃
390
X,Y-CTE
2.4.24.5
TMA
ppm/℃
15～17
Z axis-CTE
2.4.24
TMA，Before TG
ppm/℃
51
TMA，After TG
ppm/℃
298
50～260℃
%
4.2
Thermal stress
2.6.8
288℃，solder dip
s
＞300
Physical
High transmittance
GB/T 2410-2008
A
Thickness:0.10mm
%
86
High transmittance
GB/T 2410-2008
180℃/30min；
Thickness:0.10mm
%
85
Halogen Content
Chlorine
Bromine
Chlorine+ Bromine
2.2.41
A
ppm
＜900
＜900
＜1500
Flexural Strength
LW
CW
2.4.4
A
MPa
480
430
Flexural modulus
JB/T 6544-1993
A
GPa
22
Moisture Absorption
2.6.2.1
D-24/23
%
0.17
Electrical
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ-cm
＞10^8
Surface Resistivity
2.5.17.1
C-96/35/90
MΩ
＞10^8
Dk（RC50%）
2.5.5.9
1GHz;C-24/23/50
/
4.1
Df（RC50%）
2.5.5.9
1GHz;C-24/23/50
/
0.023
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