What do we doWhat do we do
What do we do
Provide one-stop high-quality and fast services for material technology innovation in the packaging carrier industry
Electronic materials
The world is continuously evolving, with software and electronic products consistently positioned at the forefront of innovation. Hinnotech is committed to advancing innovation and are steadfastly focused on developing new materials that enhance the performance of electronic products.
Electronic materials
Related products
Conventional FR4 materials
  • Material name
  • TG
  • Product Overview
  • application area
  • More details
  • H-880G
    170℃
    High Tg, Low CTE Laminate&Prepreg
    Multilayer PCB，LCD Back panel，Server，Office Router， Base station，Celluar Phone .etc
    View more
    High Tg, Low CTE Laminate&Prepreg
    Multilayer PCB，LCD Back panel，Server，Office Router， Base station，Celluar Phone .etc
    Tg 170℃(DSC)
    Df 0.0100( 1G)
    Td 390℃
    Flammability Rating 94UL-V0
    Thickness uniformity control technology
    Lead free process compatible
    Excellent dimensional stability
    Low Z-axis CTE and excellent through hole reliability
    IPC-4101E/ 127/ 128/ 130

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

     

    Thermal

     

    GlassTransitionTemperature

     2.4.24.4

     DMA

    C

     200

     2.4.25

     DSC

    C

     180

    X,Y-CTE

     2.4.24.5

     TMA

    ppm/C

    12 ~ 14

     

     

     

    Z axis-CTE

     

    2.4.24

    TMA，Before TG

    ppm/C

     40

    TMA，After TG

    ppm/C

     200

    50 ~ 260C

    %

     2.1

     T288

    min

    ≧60

     T300

    min

    ≧60

    2Thermal  stress

     2.6.8

    288C，solder dip

     S

     Pass

    (weight loss 5%)   Decomposition temperature

     2.4.24.6

     TGA

    C

     390

     

     

     

     

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

     MΩ-cm

    ＞10^8

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    ＞10^8

    Arc Resistance

     2.5.1

     A

     S

     120

    Dielectric Breakdown

     2.5.6

     A

     KV

     40

    Electric Strength 

    (thickness<0.5mm)

     2.5.6.2

     A

    KV/mm

     40

    CTI

     ASTMD3638

     A

    PLC(V)

    3( 175-249)

     

     Permittivity(RC54%)

    2.5.5.9/2.5.5.13

     1GHz

    /

    4. 15/4.30

     

    2.5.5.13

     5GHz

    /

     4.26

     10GHz

    /

     4.23

     

     Loss Tangent(RC54%)

    2.5.5.9/2.5.5.13

     1GHz

    /

    0.0100/0.0110

     

    2.5.5.13

     5GHz

    /

     0.0120

     10GHz

    /

     0.0130

     

     

     

    Physical

     

    Flexural Strength

     

     2.4.4

     

     A

     LW

     

    MPa

     500

     CW

     400

    Peel Strength (1oz HTE)

     

    2.4.8

     

    288C/10s

     

    lb/inch

     

    8.0

    Flammability

     

    UL94

     

    UL94

    /

     

    V-0

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0.1

  • H-850G
    150℃
    Middle Tg,Halogen-free Laminate&Prepreg
    Computer，Instrumentation，Mobile Communication, Game machine，Smart Phone
    View more
    Middle Tg,Halogen-free Laminate&Prepreg
    Computer，Instrumentation，Mobile Communication, Game machine，Smart Phone
    Halogen Free and Tg150℃(DSC)
    Low Z-CTE and excellent through hole reliability
    Excellent thermal stability and Chemical Resistance
    Low water absorption and Anti-CAF capability
    Good dimensional stability and use for HDI process

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

    Thermal

    Glass Transition Temperature

     2.4.24.4

     DSC

    ℃

     150

     

     Z axis-CTE

     

     2.4.24

    TMA Before TG

    ppm/℃

    35

    TMA After TG

    ppm/℃

    220

    50 ~ 260℃

    %

    3.0

     

    T288

     

    2.4.24.1

    Clad

    min

    ＞30

    Etched

    min

    ＞30

    2Thermal stress

     2.6.8

    288℃ ，solder dip

     S

    ＞300

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    360

     

     

     

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MQ-cm

    ＞10^9

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MQ

    ＞10^10

    Dk(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    4.60

    Df(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    0.011

    CAF Resistance

     2.6.25

     A

    /

    Pass

    Dielectric Breakdown

     2.5.6

     A

    kv

     60

    Arc Resistance

     2.5.1

     A

    s

     125

     

     

     

    Physical

    Flexural Strength

    LW

    CW

     2.4.4

     A

    MPa

    510

    450

    Peel Strength

      ( HozCopperFoil)

     

    2.4.8

     

    288℃/10s

     

    lb/inch

     

    7.5

    Flammability

     UL94

     UL94

    /

     V0

    Moisture Absorption

     2.6.2.1

    D-24/23

    %

     0. 19
  • H-880
    170℃
    High Tg, Low CTE Laminate&Prepreg
    Automobile, Backplanes, Servers and Networking, Data Storage, Tele communications
    View more
    High Tg, Low CTE Laminate&Prepreg
    Automobile, Backplanes, Servers and Networking, Data Storage, Tele communications
    High Tg 170(DSC) and high thermal reliability
    Low Z-CTE and excellent through hole reliability
    Suitable for high thermal reliability and Lead free assemblies
    Anti-CAF capability
    Meeting the need of Multilayer and High Layer PCB

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

    Thermal

     Glass Transition Temperature

     2.4.24.4

     DSC

    ℃

     175

     

     Z axis-CTE

     

     2.4.24

    TMA Before TG

    ppm/℃

    35

    TMA After TG

    ppm/℃

    210

    50 ~ 260℃

    %

    2.6

     

    T288

     

     2.4.24.1

    Clad

    min

    ＞15

    Etched

    min

    ＞15

    Thermal stress

     2.6.8

    288℃ ，solder dip

     S

    ＞600

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    345

     

     

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MQ-cm

    ＞10^9

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MQ

    ＞10^10

    Dk(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    4.58

    Df(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    0.0143

    CAF Resistance

     2.6.25

     A

    /

    Pass

    Dielectric Breakdown

     2.5.6

     A

    kv

     60

    Arc Resistance

     2.5.1

     A

    s

     125

     

     

     

     

    Physical

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

    MPa

    520

    450

    Peel Strength

      (Hoz Copper Foil)

     

    2.4.8

     

    288℃/10s

     

    lb/inch

     

    7.5

    Flammability

     UL94

     UL94

    /

     V0

    Moisture Absorption

     2.6.2.1

    D-24/23

    %

     0.08
  • H-850
    150℃
    Middle Tg, Lead Free Laminate&Prepreg
    PCs and NB，Automobile, Instrument, Game Machine,Tele communications
    View more
    Middle Tg, Lead Free Laminate&Prepreg
    PCs and NB，Automobile, Instrument, Game Machine,Tele communications
    Mid Tg150℃(DSC) and excellent thermal reliability
    LowZ-CTE and excellent through hole reliability
    Suitable for Lead free process
    Anti-CAF capability
    Meeting the need of Multilayer Layer PCB

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

    Thermal

    Glass  Transition  Temperature

     2.4.24.4

     DSC

    ℃

     150

     

     Z axis-CTE

     

     2.4.24

    TMA Before TG

    ppm/℃

    45

    TMA After TG

    ppm/℃

    245

    50 ~ 260℃

    %

    3.2

     

    T288

     

     2.4.24.1

    Clad

    min

    ＞15

    Etched

    min

    ＞15

    Thermal stress

     2.6.8

    288℃ ，solder dip

     S

    ＞300

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    345

     

     

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MQ-cm

    ＞10^9

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MQ

    ＞10^10

    Dk(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    4.58

    Df(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    0.0141

    CAF Resistance

     2.6.25

     A

    /

    Pass

    Dielectric Breakdown

     2.5.6

     A

    KV

     60

    Arc Resistance

     2.5.1

     A

    s

     125

     

     

     

     

    Physical

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

    MPa

    520

    450

    Peel Strength

      (Hoz Copper Foil)

     

    2.4.8

     

    288℃/10s

     

    lb/inch

     

    7.5

    Flammability

     UL94

     UL94

    /

     V0

    Moisture Absorption

     2.6.2.1

    D-24/23

    %

     0. 18

    The  above data  and fabrication guide  provide  designers  and  PCB  shop  for their  reference.  We  believe  that these  information area  accurate, however,

    the data may vary depend on the test methods and specification used. The actual sales of the product should be according to    specification in the agreement between HINNO and its customer. HINNO reserves the right to revise its data at anytime without notice and maintain the best

    information available to users.

  • H-840N
    135℃
    Normal Tg Laminate & Prepreg
    PCs and NB、Instrumentation、VCR、Automobiles etc.
    View more
    Normal Tg Laminate & Prepreg
    PCs and NB、Instrumentation、VCR、Automobiles etc.
    Tg135C(DSC)
    Low absorption water and chemical resistance
    UV Blocking/AOI compatible

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

     

     Thermal

    Glass  Transition Temperature

     

    2.4.24.4

     

    DSC

    ℃

     

    135

     

     Z axis-CTE

     

     2.4.24

    TMA Before TG

    ppm/℃

    55

    TMA After TG

    ppm/℃

    295

    50 ~ 260℃

    %

    4.2

    T288

     2.4.24.1

    Etched

    min

     2

    T260

     2.4.24.1

    Etched

    min

     15

    Thermal stress

     

    2.6.8

    288℃ ，solder dip

     

    S

     

    180

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    310

     

     

     

     Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MQ-cm

    ＞10^9

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MQ

    ＞10^10

    Dk(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    4.32

    Df(RC50%)

    2.5.5.9

    1GHz;C-24/23/50

    /

    0.017

    CAF Resistance

     2.6.25

     A

    /

    Pass

    Dielectric Breakdown

     2.5.6

     A

    kv

     60

    Arc Resistance

     2.5.1

     A

    s

     120

     

     

     

    Physical

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

    MPa

    500

    420

    Peel Strength

      (Hoz Copper Foil)

     

    2.4.8

     

    288℃/10s

     

    lb/inch

     

    10

    Flammability

     UL94

     UL94

    /

     V0

    Moisture Absorption

     2.6.2.1

    D-24/23

    %

     0.25

    The  above data  and fabrication guide  provide  designers  and  PCB  shop  for their  reference.  We  believe  that these  information area  accurate, however.

    The data may vary depend on the test methods and specification used. The actual sales of the product should be according to   specification in the agreement between HINNO and its customer. HINNO reserves the right to revise its data at anytime without notice and maintain the best

    information available to users.

No-flow Prepreg
  • Material name
  • TG
  • Product Overview
  • application area
  • More details
  • Y-170NFP
    180℃
    Dust Free&High Tg No-flow Prepreg
    Multilayer rigid-flex boards, Heat sink bonding.etc
    View more
    Dust Free&High Tg No-flow Prepreg
    Multilayer rigid-flex boards, Heat sink bonding.etc
    Low resin flow ,Halogen free andT g180℃ (DMA)
    Dust-free during processing
    Excellent thermal stability and Chemical Resistance
    Low water absorption and Anti-CAF capability
    Suitable for Lead- Free Process

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

    Thermal

       Glass Transition Temperature

     2.4.24.4

     DMA

    ℃

     180

     

    Z axis-CTE

     

     2.4.24

    TMA，Before TG

    ppm/℃

    58

    TMA，After TG

    ppm/℃

    300

    50 ~ 260℃

    %

    3.8

    T288

     2.4.24.1

     TMA

    min

    ＞20

    T260

     2.4.24.1

     TMA

    min

    ＞60

    Thermal stress

     2.6.8

    288℃ ，solder dip

     S

    ＞300

    (weight loss 5%)   Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    350

     

    Electrical

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^6

    Surface Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ

    ＞10^6

     

    Dust

    HINNO test method

    Internal standard

    /

    Dust free

    Resin Flow

    HINNO test method

    Internal standard

     mm

    0.5

     

     

     

    Physical

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

     

    MPa

    425

    365

    Peel Strength

    (Hoz Copper Foil)

     

    2.4.8

     

    A

     

    Kgf/cm

     

    1.2

    Peel Strength

     ( FCCL PI Side)

     

    2.4.8

     

    A

     

    Kgf/cm

     

    0.9

    Dimensional Stability after thermal(MD/TD)

     

    2.2.4

     

    A

     

    %

     

    -0.06/-0.06

    Moisture  Absorption

     2.6.2.1

    D-24/23

    %

     0. 15

    Halogen Content      Chlorine

    Bromine                        Chlorine+Bromine

     

     

    2.2.41

     

     

    A

     

     

    ppm

     

    ＜900

    ＜900

    ＜1500
Composite materials
  • Material name
  • TG
  • Product Overview
  • application area
  • More details
  • H-858G
    140℃
    Black, Halogen-free Stiffeners Material
    FPC stiffeners, Smart phone component, Tablet PC component,Stiffeners,Carbody .etc
    View more
    Black, Halogen-free Stiffeners Material
    FPC stiffeners, Smart phone component, Tablet PC component,Stiffeners,Carbody .etc
    Black, Halogen-free,94V-0 andTg140℃ (DSC)
    High machine strength
    Excellent mechanical processablity
    Excellent thermal stability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

    Thermal

    Glass Transition Temperature

     2.4.24.4

     DSC

    ℃

     140

     

     Z axis-CTE

     

     2.4.24

    TMA， Before TG

    ppm/℃

    55

    TMA,    After TG

    ppm/℃

    300

    50 ~ 260℃

    %

    4.0

    T288

    2.4.24.1

    2

    s

    ＞5

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    355

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MΩ-cm

    ＞10^3

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    ＞10^3

    Dielectric Breakdown

     2.56

     A

     KV

     40

     

     

    Physical

    Chemical resistance

     2.3.2

     A

     -

    Pass

    Halogen Content 

    Chlorine

    Bromine

    Chlorine+ Bromine

     

     

    2.2.41

     

     

    A

     

     

    2.2.41

    ＜900

    ＜900

    ＜1500

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

    M Pa

    585

    485

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0.25
  • H-855G
    145℃
    Yellow , Halogen-free Stiffeners Material
    FPC stiffeners, Carbody.etc
    View more
    Yellow , Halogen-free Stiffeners Material
    FPC stiffeners, Carbody.etc
    Yellow and has textured feeling on the surface
    Halogen-free,94V-0 and Tg 145℃ ( DSC)
    High machine strength
    Excellent mechanical processablity
    Excellent thermal stability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

    Thermal

    Glass Transition Temperature

     

    2.4.24.4

     

    DSC

    ℃

     

    145

     

     

    Z  axis-CTE

     

     

     

    2.4.24

    TMA， Before TG

    ppm/℃

    55

    TMA ,  After  TG

    ppm/℃

    280

    50 ~ 260℃

    %

    3.8

    T288

    2.4.24.1

    TMA

    s

    ＞5

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    355

     

     

     

     Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MΩ-cm

    ＞10^8

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    ＞10^8

    Dielectric Breakdown

     2.5.6

     A

     KV

     40

    DK( 1G， RC50)

    2.5.5.9

    C-24/23/50

     

    -

    4.78

    DF( 1G， RC50)

    2.5.5.9

    C-24/23/50

     

    -

    0.012

    Physical

    Chemical resistance

     2.3.2

     A

     -

    Pass

    Halogen Content

    Chlorine

    Bromine

    Chlorine+ Bromine

     

     

    2.2.41

     

     

    A

     

     

    2.2.41

    ＜900

    ＜900

    ＜1500

    Flexural  Strength

    LW

    CW

     

    2.4.4

     

    A

    MPa

    585

    485

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0.22
  • H-830G
    130℃
    Low Dust Halogen Free Al Nonwoven Glass Fabric Stiffener
    Punchable stiffeners,Carbody .etc
    View more
    Low Dust Halogen Free Al Nonwoven Glass Fabric Stiffener
    Punchable stiffeners,Carbody .etc
    Halogen-free and Tg130℃ ( DSC)
    Low dust generation
    Good punching property
    Excellent thermal stability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

     

    Thermal

    Glass Transition Temperature

     

    2.4.24.4

     

    DSC

    ℃

     

    130

     

     Z axis-CTE

     

     

     

    2.4.24

    TMA Before TG

    ppm/℃

    53

    TMA After TG

    ppm/℃

    295

    50 ~ 260℃

    %

    4.2

    T288

    2.4.24.1

    2

    s

    ＞5

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    360

     

     Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MΩ-cm

    ＞10^6

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    ＞10^6

    Dielectric Breakdown

     2.56

     A

     KV

     30

     

     

     

     Physical

    Dust Generation

    Hinno test method

    /

    mg/m

    <5

    Chemical Resistance

     2.3.2

     A

    /

    Pass

     Halogen Content     

     Chlorine

     Bromine

     Chlorine+ Bromine

     

     

    2.2.41

     

     

    A

     

     

    2.2.41

    ＜900

    ＜900

    ＜1500

    Moisture  Absorption

     2.6.2.1

    D-24/23

    %

    <0. 15
  • H-827G
    110℃
    Black, Anti static Stiffeners Material
    FPC stiffeners, Car body,Fixture.etc
    View more
    Black, Anti static Stiffeners Material
    FPC stiffeners, Car body,Fixture.etc
    Black，Antistatic
    Halogen-frec, Tg110C( DSC)
    High machine strength
    Excellent mechanical proeessablity
    Excellent thermal stability

    Property

    Item

    IPC-TM-650

    Test Condition

    Units

    Typical value

    Thermal

    Glass TransitionTemperature

    2.4.24.4

    DSC

    ℃

    110

    Z axis-CTE

    2.4.24

    TMA，Before TG

    ppm/℃

    55

    TMA，After TG

    ppm/℃

    350

    50～260℃

    %

    3.7

    T288

    2.4.24.1

    TMA

    s

    ＞5

    (weight loss 5%)

    Decomposition temperature

    2.4.24.6

    TGA

    ℃

    355

    Electrical

    Volume Resistivity

    2.5.17.1

    C-96/35/90

    MΩ-cm

    10^4

    Surface Resistivity

    2.5.17.1

    C-96/35/90

    MΩ

    10^4

    DK(1G，RC50)

    2.5.5.9

    C-24/23/50

    -

    4.78

    DF(1G，RC50)

    2.5.5.9

    C-24/23/50

    -

    0.012

    Physical

    Chemical  resistance

    2.3.2

    A

    -

    Pass

     Halogen Content

     Chlorine

     Bromine

     Chlorine+ Bromine

    A

    A

    2.2.41

    ＜900

    ＜900

    ＜1500

    Flexural Strength

    LW

    CW

    2.4.4

    A

    MPa

    550

    485

    Moisture Absorption

    2.6.2.1

    D-24/23

    %

    0.22
  • H-810G
    110℃
    High Transparency Stiffener
    Smartphone component,Tablet PC component,Carbody etc
    View more
    High Transparency Stiffener
    Smartphone component,Tablet PC component,Carbody etc
    Halogen free and Tg110℃(DSC)
    High mechanical strength
    Excellent mechanical processability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

    Thermal

    Glass Transition Temperature

     2.4.24.4

     DSC

    ℃

     110

     

     Z axis-CTE

     

     2.4.24

    TMA Before TG

    ppm/℃

    55

    TMA After TG

    ppm/℃

    295

    50 ~ 260℃

    %

    4.3

    T288

    2.4.24.1

    2

    s

    ＞5

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    370

     

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MΩ-cm

    2.5*10^9

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    2.5*10^8

    Dielectric Breakdown

    2.5.6

    A

    KV

    60

     

     

     

    Physical

    Chemical resistance

    2.3.2

    A

     -

    Pass

    Dyne Value

    ASTMSTDD6182

    A

    dyn/cm

    50

     Halogen Content

     Chlorine

     Bromine

     Chlorine+ Bromine

     

    2.2.41

     

    A

     

    2.2.41

    ＜900

    ＜900

    ＜1500
  • H-825GAP/H-825GA-BP
    110℃
    Rapid Curing&High Transparency Prepreg
    Smartphone component, Tablet PC component, Car body etc
    View more
    Rapid Curing&High Transparency Prepreg
    Smartphone component, Tablet PC component, Car body etc
    Rapid curing
    Halogen free，94V0，and Tg110C( DSC)
    High mechanical strength
    Excellent mechanical processability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

    Reactivity

    Curing Speed

     

    /

     

    150℃

     

    min

     

    5

    Thermal

    GlassTransitionTemperature

     2.4.24.4

     DSC

    ℃

     110

     

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

     MΩ-cm

    1.6*10^6

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    1.3*10^6

    Dielectric Breakdown

    2.5.6

    A

    KV

    45

     

     

     

     

    Physical

    Chemical resistance

    2.3.2

    A

    /

    Pass

    Halogen Content

    Chlorine

    BromineChlorine+ Bromine

     

    2.2.41

     

    A

     

    2.2.41

    ＜900

    ＜900

    ＜1500

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

     

    MPa

    480

    420

    Moisture Absorption

     2.6.2.1

    D-24/23

    %

     0. 18
  • H-815G
    110℃
    Yellow,Halogen-free Stiffeners
    FPC stiffeners, Carbody etc
    View more
    Yellow,Halogen-free Stiffeners
    FPC stiffeners, Carbody etc
    Yellow, Halogen free, 94V- 1 and Tg120℃ (DSC)
    High machine strength
    Excellent mechanical processablity
    Excellent thermal stability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

    Thermal

    Glass  Transition  Temperature

     2.4.24.4

     DSC

    ℃

     110

     

     

    Z axis-CTE

     

     

     

    2.4.24

    TMA， Before TG

    ppm/℃

    55

    TMA After TG

    ppm/℃

    295

    50 ~ 260℃

    %

    4.3

    T288

    2.4.24.1

    2

    s

    ＞5

    (weight loss 5%)     Decomposition temperature

     

    2.4.24.6

     

    TGA

    ℃

     

    370

     

    Electrical

    Volume Resistivity

     2.5.17.1

    C-96/35/90

    MΩ-cm

    2.5*10^9

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    2.5*10^8

    Dielectric Breakdown

    2.56

    A

    KV

    60

     

     

     

    Physical


     

     

    Chemical resistance

    2.3.2

    A

     -

    Pass

    Dyne Value

    ASTMSTDD6182

    A

    dyn/cm

    50

    Halogen Content

    Chlorine

    Bromine

    Chlorine+ Bromine

     

    2.2.41

     

    A

     

    2.2.41

    ＜900

    ＜900

    ＜1500

    Flexural Strength LW

                                        CW

     2.4.4

     A

    MPa

    480

    420

    Moisture Absorption

     2.6.2.1

    D-24/23

    %

     0. 18

  • Y-205TS/Y-205BS
    120℃
    White,High Surface Hardness Stiffener
    Smartphone component, Tablet PC component, Car body etc.
    View more
    White,High Surface Hardness Stiffener
    Smartphone component, Tablet PC component, Car body etc.
    White, High Surface Hardness(＞8H)
    Halogen freeand High modulus
    Excellent mechanical processability

    Property

    Item

    IPC-TM-650/GB

    Test Condition

    Units

    Typical value

     

     

    Thermal

    GlassTransition

    Temperature

     

    2.4.24.4

     

    DSC

     

    ℃

     

    120

    2Thermal stress

     2.6.8

    288℃ ，solder dip

    s

    ＞300

     

     

     

    Physical

    Surface Hardness

     GB 6739- 1986

     A

     H

    ＞8

    Halogen Content 

    Chlorine

    Bromine

    Chlorine+ Bromine

     

    2.2.41

     

    A

     

    ppm

    ＜900

    ＜900

    ＜1500

    Flexural Strength

    LW

    CW

     

    2.4.4

     

    A

     

    MPa

    580

    550

    Moisture Absorption

     

    2.6.2.1

     

    D-24/23

     

    %

     

    0.25

     

    Electrical

    Volume Resistivity

     

    2.5.17.1

     

    C-96/35/90

     

    MΩ-cm

     

    1. 1*10^8

    Surface Resistivity

     

    2.5.17.1

     

    C-96/35/90

     

    MΩ

     

    1.3*10^8
  • Y-920GT
    140℃
    High Light Transmittance Laminate
    Display screen
    View more
    High Light Transmittance Laminate
    Display screen
    Halogen Free and High light transmittance
    High mechanical strength
    Excellent mechanical processability

    Property

    Item

    IPC-TM-650/GB

    Test Condition

    Units

    Typical value

    Thermal

    Glass Transition Temperature

    2.4.24.4

    DSC

    ℃

    140

    Decomposition temperature

    2.4.24.6

    TGA

    ℃

    390

    X,Y-CTE

    2.4.24.5

    TMA

    ppm/℃

    15～17

    Z axis-CTE

    2.4.24

    TMA，Before TG

    ppm/℃

    51

    TMA，After TG

    ppm/℃

    298

    50～260℃

    %

    4.2

    Thermal stress

    2.6.8

    288℃，solder dip

    s

    ＞300

    Physical

    High transmittance

    GB/T 2410-2008

    A

    Thickness:0.10mm

    %

    86

    High transmittance

    GB/T 2410-2008

    180℃/30min；

    Thickness:0.10mm

    %

    85

    Halogen Content

    Chlorine

    Bromine

    Chlorine+ Bromine

    2.2.41

    A

    ppm

    ＜900

    ＜900

    ＜1500

    Flexural Strength

    LW

    CW

    2.4.4

    A

    MPa

    480

    430

    Flexural modulus

    JB/T 6544-1993

    A

    GPa

    22

    Moisture Absorption

    2.6.2.1

    D-24/23

    %

    0.17

    Electrical

    Volume Resistivity

    2.5.17.1

    C-96/35/90

    MΩ-cm

    ＞10^8

    Surface Resistivity

    2.5.17.1

    C-96/35/90

    MΩ

    ＞10^8

    Dk（RC50%）

    2.5.5.9

    1GHz;C-24/23/50

    /

    4.1

    Df（RC50%）

    2.5.5.9

    1GHz;C-24/23/50

    /

    0.023

HSD material
  • Material name
  • TG
  • Product Overview
  • application area
  • More details
  • Y-5335
    210℃
    High Tg，Ultra Low loss Laminate&Prepreg
    Multilayer PCB, Server, Router, Base station，RF/wireless Communication.etc
    View more
    High Tg，Ultra Low loss Laminate&Prepreg
    Multilayer PCB, Server, Router, Base station，RF/wireless Communication.etc
    Tg 210℃(DMA)
    Df 0.0050( 10GHz)
    Flammability Rating 94V-0
    Thickness uniformity control technology
    Lead free process compatible
    Excellent dimensional stability
    Low Z-axis CTE and excellent through hole reliability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

    Thermal

     GlassTransitionTemperature

     

    2.4.24.4

     

    DMA

    C

     

    210

     

    2.4.25

     

    DSC

    C

     

    200

    X,Y-CTE

     

    2.4.24.5

     

    TMA

    ppm/C

    11~ 14

    Zaxis-CTE

     

     

     

     

     

     

    2.4.24

    TMA，BeforeTG

    ppm/C

     

    42

    TMA，AfterTG

    ppm/C

     

    220

    50 ~ 260C

    %

     

    2.3

     

    T288

    min

    ≧120

     

    T300

    min

    ≧120

    Thermalstress

     

    2.6.8

    288C，solderdip

     

    S

     

    Pass

    (weight loss 5%)   Decompositiont emperature

     

    2.4.24.6

     

    TGA

    C

     

    400

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^8

    Electrical

    Surface Resistivity

    2.5.17.1

    C-96/35/90

    MΩ

    ＞10^8

    Arc  Resistance

    2.5. 1

    A

    S

    120

    DielectricBreakdown

    2.5.6

    A

    KV

    40

    ElectricStrength

    (thickness<0.5mm)

    2.5.6.2

    A

    KV/mm

    40

    Permittivity(RC54%)

    2.5.5.13

    1GHz

    /

    3.75

    5GHz

    /

    3.73

    10GHz

    /

    3.72

    Loss Tangent( RC54%)

    2.5.5.13

    1GHz

    /

    0.0040

    5GHz

    /

    0.0045

    10GHz

    /

    0.0050

     

    Physical

    Flexural Strength

    2.4.4

    A

    LW

    MPa

    450

    CW

    380

    Peel Strength

    ( 1oz VLP)

    2.4.8

    288C/10s

    lb/inch

    4.5

    Flammability

    UL94

    UL94

    /

    V-0

    Moisture Absorption

    2.6.2.1

    D-24/23

    %

    0.07
  • Y-5325
    200℃
    High Tg，Lead-Free and very low loss Laminate&Prepreg
    RF antenna, Network equipment，High frequency measuring instruments.etc
    View more
    High Tg，Lead-Free and very low loss Laminate&Prepreg
    RF antenna, Network equipment，High frequency measuring instruments.etc
    High Tg( Tg：200℃)
    Lower DK and low DF
    Stable DK/DF with different environment
    Low Z-CTE and excellent through hole reliability
    Compatible with lead-free process

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

     

     

     

     

     

     Thermal

     

    Glass Transition Temperature

     

    2.4.24.4

     

    DMA

    C

     

    200

     

    2.4.25

     

    DSC

    C

     

    180

    X,Y-CTE

     

    2.4.24.5

     

    TMA

    ppm/C

    11~ 14

     

     

     

     

    Z axis-CTE

     

     

     

     

     

     2.4.24

    TMA，BeforeTG

    ppm/C

     

    42

    TMA，AfterTG

    ppm/C

     

    230

    50 ~ 260C

    %

     

    2.4

     

    T288

    min

    ≧60

     

    T300

    min

    ≧60

    Thermal stress

     

    2.6.8

    288C，solderdip

     

    S

     

    Pass

    (weight loss 5%)   Decomposition temperature

     

    2.4.24.6

     

    TGA

    C

     

    340

     

     

    Electrical

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^8

    Surface Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ

    ＞10^8

    Arc Resistance

     

    2.5. 1

     

    A

     

    S

     

    120

     

    Dielectric Breakdown

     

    2.5.6

     

    A

     

    KV

     

    40

    ElectricStrength

    (thickness<0.5mm)

     

    2.5.6.2

     

    A

     

    KV/mm

     

    40

     

     

    Permittivity( RC54%)

     

     

     

    2.5.5.13

     1GHz

    /

     3.75

     5GHz

    /

     3.75

     10GHz

    /

     3.70

     

     

    LossTangent( RC54%)

     

     

    2.5.5.13

     1GHz

    /

     0.0065

     5GHz

    /

     0.0065

     10GHz

    /

     0.0070

     

     

     

     

    Physical

     

    Flexural Strength

     

     

    2.4.4

     

     

    A

     

    LW

     

     

    MPa

     

    480

     

    CW

     

    420

    Peel Strength

      ( 1ozVLP)

     

    2.4.8

     

    288C/10s

     

    lb/inch

     

    7.5

    Flammability

     UL94

     UL94

    /

     V-0

    Moisture  Absorption

     2.6.2.1

    D-24/23

    %

     0.09
  • Y-5215
    180℃
    High Tg，Lead-Free and very low loss Laminate&Prepreg
    Server/Storage, Routers, Backplane, Basestation .etc
    View more
    High Tg，Lead-Free and very low loss Laminate&Prepreg
    Server/Storage, Routers, Backplane, Basestation .etc
    Halogen-free, High Tg(Tg:180℃)
    Lower DK and low DF
    Stable DK/DF with different environment
    Low Z-CTE and excellent through hole reliability
    Compatible with lead-freeprocess

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

     

     

     

     Thermal

     

     

     

     

     

     

    Glass Transition Temperature

     

    2.4.25

     

    DSC

    C

     

    180

    X,Y-CTE

     

    2.4.24.5

     

    TMA

    ppm/C

    12~ 14

     

     

     

     

     

    ZZ axis-CTE

     

     

     

     

     

     

    2.4.24

    TMA，Before TG

    ppm/C

     

    41

    TMA，After TG

    ppm/C

     

    238

    50 ~ 260C

    %

     

    2.7

     

    T288

    min

    ≧60

     

    T300

    min

    ≧60

    Thermal stress

     

    2.6.8

    288C，solder dip

     

    S

     

    Pass

    (weight loss 5%)   Decomposition temperature

     

    2.4.24.6

     

    TGA

    C

     

    380

     

     

     

     

    Electrical

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^8

    Surface Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ

    ＞10^8

    Arc Resistance

     

    2.5. 1

     

    A

     

    S

     

    120

     Dielectric Breakdown

     

    2.5.6

     

    A

     

    KV

     

    40

     

     

     

     

     

     

    Electrical

     

     

     

    Electric Strength      

      (thickness<0 5mm)

     

    2.5.6.2

     

    A

     

    KV/mm

     

    40

     

     

      Permittivity( RC50%)

     

     

     

    2.5.5.13

     

    1GHz

    /

     

    3.9

     

    5GHz

    /

     

    3.8

     

    10GHz

    /

     

    3.8

     

     

    LossTangent( RC50%)

     

     

     

    2.5.5.13

     

    1GHz

    /

     

    0.008

     

    5GHz

    /

     

    0.008

     

    10GHz

    /

     

    0.009

     

     

     

     

     

     

    Physical

     

    FlexuralStrength

     

     

    2.4.4

     

     

    A

     

    LW

     

     

    MPa

     

    490

     

    CW

     

    420

    Peel Strength

      ( 1ozVLP)

     

    2.4.8

     

    288C/10s

     

    lb/inch

     

    5.5

    Flammability

     

    UL94

     

    UL94

    /

     

    V-0

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0. 11
  • Y-5225
    180℃
    High Tg, Lead-Free and very low loss Laminate&Prepreg
    Server/Storage, Routers, Backplane, Base station. etc
    View more
    High Tg, Lead-Free and very low loss Laminate&Prepreg
    Server/Storage, Routers, Backplane, Base station. etc
    Halogen-free, High Tg(Tg:180℃)
    Lower DK and low DF
    Stable DK/DF with different environment
    Low Z-CTE and excellent through hole reliability
    Compatible with lead-free process

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

    Glass Transition Temperature

     

    2.4.25

     

    DSC

    C

     

    180

    X,Y-CTE

     

    2.4.24.5

     

    TMA

    ppm/C

    12~ 14

     

     

     

    Zaxis-CTE

     

     

     

     

     2.4.24

    TMA，BeforeTG

    ppm/C

     

    42

    TMA，AfterTG

    ppm/C

     

    230

    50 ~ 260C

    %

     

    2.7

     

    T288

    min

    ≧60

     

    T300

    min

    ≧60

    Thermal stress

     

    2.6.8

    288C，solderdip

     

    S

     

    Pass

    (weight loss 5%)   Decomposition temperature

     

    2.4.24.6

     

    TGA

    C

     

    385

     

     

     

     

    Electrical

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^8

    Surface Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ

    ＞10^8

    Arc Resistance

     

    2.5. 1

     

    A

     

    S

     

    120

    Dielectric Breakdown

     

    2.5.6

     

    A

     

    KV

     

    40

     

    Electric Strength

     (thickness<0 5mm)

     

    2.5.6.2

     

    A

     

    KV/mm

     

    40

     

     

    Permittivity ( RC54%)

     

     

     2.5.5.13

     

    1GHz

    /

     

    3.9

     

    5GHz

    /

     

    3.9

     

    10GHz

    /

     

    3.8

     

     

    Loss Tangent( RC54%)

     

     

     2.5.5.13

     

    1GHz

    /

     

    0.0060

     

    5GHz

    /

     

    0.0075

     

    10GHz

    /

     

    0.0080

     

     

     

     

     Physical

     

    Flexural  Strength

     

     

    2.4.4

     

     

    A

     

    LW

     

     

    MPa

     

    480

     

    CW

     

    410

    Peel Strength

      (1ozLP)

     

    2.4.8

     

    288C/10s

     

    lb/inch

     

    5.0

    Flammability

     

    UL94

     

    UL94

    /

     

    V-0

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0.09
  • Y-5335F
    220℃
    High Tg,UltraLow loss, Halogen Free Laminate&Prepreg
    Multilayer PCB, Server, Router, Base station，RF/wireless Communication etc.
    View more
    High Tg,UltraLow loss, Halogen Free Laminate&Prepreg
    Multilayer PCB, Server, Router, Base station，RF/wireless Communication etc.
    Tg 220℃(DMA)
    Df 0.0050 (10G)
    Halogen Free, Flammability Rating 94V-0
    Thickness uniformity control technology
    Lead free process compatible
    Excellent dimensional stability
    Low Z-axis CTE and excellent through hole reliability

     

    Property

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

     

    Thermal

     

    Glass Transition Temperature

     

    2.4.24.4

     

    DMA

    C

    220

     

    2.4.25

     

    DSC

    C

     

    200

    X,Y-CTE

     

    2.4.24.5

     

    TMA

    ppm/C

    10~ 13

     

     Z axis-CTE

     

     

    2.4.24

    TMA，BeforeTG

    ppm/C

     35

    TMA，AfterTG

    ppm/C

    180

    50 ~ 260C

    %

     1.8

     T288

    min

    ≧120

     T300

    min

    ≧120

    Thermal stress

     2.6.8

    288C，solderdip

     S

     Pass

    (weight loss 5%)   Decomposition temperature

     

    2.4.24.6

     

    TGA

    C

     

    400

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^8

    Electrical

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    ＞10^8

    Arc Resistance

     2.5. 1

     A

     S

     120

    Dielectric Breakdown

     2.5.6

     A

     KV

     40

    Electric Strength

     (thickness<0.5mm)

     

    2.5.6.2

     

    A

     

    KV/mm

     

    40

     

     

    Permittivity( RC54%)

     

     

     

    2.5.5.13

     

    1GHz

    /

     

    3.75

     

    5GHz

    /

     

    3.73

     

    10GHz

    /

     

    3.72

     

     

     Loss Tangent( RC54%)

     

     

     

    2.5.5.13

     

    1GHz

    /

     

    0.0040

     

    5GHz

    /

     

    0.0045

     

    10GHz

    /

     

    0.0050

     

     

     

     

    Physical

     

    Flexural  Strength

     

     

    2.4.4

     

     

    A

     

    LW

     

     

    MPa

     

    460

     

    CW

     

    420

    Peel Strength

      (1oz VLP)

     

    2.4.8

     

    288C/10s

     

    lb/inch

     

    4.2

    Flammability

     

    UL94

     

    UL94

    /

     

    V-0

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0.08
  • Y-5355
    210℃
    High Tg,UltraLow loss Laminate&Prepreg
    Multilayer PCB, Server, Router, Base station，RF/wireless Communication etc.
    View more
    High Tg,UltraLow loss Laminate&Prepreg
    Multilayer PCB, Server, Router, Base station，RF/wireless Communication etc.
    Tg 210℃(DMA)
    Df 0.0040( 10G)
    Flammability Rating 94V-0
    Thickness uniformity control technology
    Lead free process compatible
    Excellent dimensional stability
    Low Z-axis CTE and excellent through hole reliability

     

     

    Item

     

    IPC-TM-650

     

    Test Condition

     

    Units

    Typical value

     

     

     

     

    Thermal

    Glass Transition

    Temperature

    2.4.24.4

    DMA

    C

    210

     2.4.25

     DSC

    C

     200

    X,Y-CTE

     2.4.24.5

     TMA

    ppm/C

    11~ 14

     

     axis-CTE

     

     

     2.4.24

    TMA，BeforeTG

    ppm/C

     40

    TMA，AfterTG

    ppm/C

     200

    50 ~ 260C

    %

     2.2

     T288

    min

    ≧120

     T300

    min

    ≧120

    Thermal stress

     2.6.8

    288C，solder dip

     S

     Pass

    (weight loss 5%)   Decomposition temperature

     

    2.4.24.6

     

    TGA

    C

     

    400

    Volume Resistivity

     

    2.5.17.1

    C-96/35/90

     

    MΩ-cm

    ＞10^8

     

     

     

     

     

     Electrical

     

     

     

     

    Surface Resistivity

     2.5.17.1

    C-96/35/90

     MΩ

    ＞10^8

    Arc Resistance

     2.5. 1

     A

     S

     120

    Dielectric Breakdown

     2.5.6

     A

     KV

     40

    Electric Strength 

    (thickness<0.5mm)

     

    2.5.6.2

     

    A

     

    KV/mm

     

    40

     

    Permittivity( RC54%)

     

    2.5.5.13

     1GHz

    /

     3.75

     5GHz

    /

     3.73

     10GHz

    /

     3.72

     

    Loss Tangent( RC54%)

     

    2.5.5.13

     1GHz

    /

     0.0030

     5GHz

    /

     0.0035

     10GHz

    /

     0.0040

     

     

     

     

    Physical

     

    Flexural Strength

     

     

    2.4.4

     

     

    A

     

    LW

     

     

    MPa

     

    430

     

    CW

     

    360

    Peel Strength (1ozVLP)

     

    2.4.8

     

    288C/10s

     

    lb/inch

     

    4.5

    Flammability

     

    UL94

     

    UL94

    /

     

    V-0

    Moisture Absorption

     

    2.6.2.1

    D-24/23

    %

     

    0.06
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