On July 13th, the final of the 8th China Innovation and Entrepreneurship Competition International Third Generation Semiconductor Professional Competition · Materials, Devices and Equipment Industry ended in Haining, Zhejiang. This competition focuses on advanced semiconductors and related industries, with a focus on innovative projects that are innovative, feasible, and have market prospects. It is currently the highest level, most participating projects, and largest scale innovation and entrepreneurship competition in the field of third-generation semiconductors in China. This competition is hosted by the People's Government of Haining City and the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance (CASA), and organized by the Organization Department of the Communist Party of China Haining Municipal Committee, Haining Science and Technology Bureau, and Haining Human Resources and Social Security Bureau.

After multiple rounds of screening, including solicitation, auditions, preliminary rounds, and semi-finals, more than 100 registered projects for this competition were selected, and finally 21 projects were selected to make it to the finals. After a day of intense competition, the results of the competition were finally announced, and the awards went to everyone. Guangdong Yinghua won the first prize in the competition with its microprocessor chip packaging board project. At present, the domestic market for copper-clad laminates for packaging is still dominated by foreign brands, and the industry monopoly formed by Japanese industry giants is still difficult to break in the short term. There are only one or two domestic manufacturers of copper-clad laminates for packaging, and they are currently in a small batch state. There are certain problems with product consistency and stability. Guangdong Yinghua has taken the lead in developing high-performance chip carrier boards, which have high modulus, high light resistance, low expansion coefficient, and high TG. They have successfully solved the problems of controlling the thickness uniformity and dimensional stability of the board, becoming the first in China. And break Japan's monopoly and fill the gap in the domestic market. At present, Guangdong Yinghua's packaging carrier board has entered the market and successfully obtained terminal certification from multiple large enterprises.