The 8th China Innovation and Entrepreneurship Competition International Third Generation Semiconductor Professional Competition has been held for nearly 7 months since its launch on May 8th, and finally completed the global finals on November 29th in Shunyi, Beijing. On November 30th, the 8th China Innovation and Entrepreneurship Competition International Third Generation Semiconductor Professional Competition? The "Global Finals" award ceremony was held grandly in Shunyi, Beijing.

The 'China Innovation and Entrepreneurship Competition International Third Generation Semiconductor Professional Competition' extensively collaborates with top domestic and overseas research institutes, technology incubators, industrial capital, various media, etc., attracting more than 500 projects from more than ten countries including China, the Netherlands, Italy, Switzerland, Poland, Japan, etc. The participating projects cover third-generation semiconductor core materials, devices and equipment, as well as various application fields such as new energy vehicles, 5G communication, smart energy and smart transportation, smart lighting and display technology, with high specifications, wide coverage and diversification.

The picture shows the award-winning photo of our general manager Qi Xiaolong (third from the left)

There are a total of 23 shortlisted projects in the final battle, and all the contestants who enter this stage are winners from various sub regions, and are rising stars in the third-generation semiconductor field. According to the competition rules, the participating teams conducted roadshows in sequence, covering multiple sub fields such as semiconductor material research and development, power devices, chip design, sensing technology, lighting and display. During the ten minute presentation time and five minute Q&A session, project representatives fully demonstrated the main direction and core advantages of the project. The judging panel conducted a comprehensive evaluation from five dimensions: technological products, business models, market prospects, team composition, and financial status.

The final results of the competition were announced at the award ceremony, attracting widespread attention. Guangdong Yinghua won the third prize in the global finals for its microprocessor chip packaging board project. This honor is an important milestone in our company's journey to achieve import substitution of packaging board materials, and also the result of our team's hard work and unremitting innovation. Guangdong Yinghua will continue to work hard, adhere to its original intention, and move forward on the road of occupying the domestic market and going global.