On November 13th, the 21st China International High tech Fair (referred to as the 'High tech Fair') opened in Shenzhen, Guangdong. This fair fully demonstrated the characteristics of openness and cooperation, with 44 countries and international organizations, 68 overseas groups participating, and a record high number of participating countries. In addition, more than 3300 domestic and foreign exhibitors and over 10000 projects were attracted to participate in the exhibition, with over 250 events showcasing the rapid development of technology and the flourishing of diverse industries.

The theme of this year's High Tech Fair is' Building a Vibrant Bay Area, Joining Hands for Open Innovation ', highlighting the construction of the Guangdong Hong Kong Macao Greater Bay Area. Special exhibition areas and urban forums have been set up to gather government officials, corporate executives, technical experts, and academic experts from relevant cities in the Greater Bay Area to exchange the achievements of the construction of the Guangdong Hong Kong Macao Greater Bay Area. In the Guangdong Hong Kong Macao Greater Bay Area exhibition area, Jiangmen City has a total of 6 technology projects participating, such as new materials, new generation information technology, equipment manufacturing, and optoelectronic display, which are new products and technologies in high-tech cutting-edge fields. This includes our company Guangdong Yinghua's microprocessor chip packaging carrier board.

Our company is honored to be invited to this year's High Tech Fair. The exhibited products include our white board for LED (Mini/MicroLED) packaging, black board for LED packaging substrate, and board for high-performance module carrier. These boards are our main product series, with excellent thickness uniformity, dimensional stability, and excellent packaging performance. At the same time, our company also showcased Guangdong Yinghua's resin synthesis technology with independent intellectual property rights and its own patented ultra-thin copper foil and ultra-thin glass cloth composite technology - this is the combination of the world's thinnest copper foil, thinnest glass cloth, and proprietary synthetic resin, with a final product thickness of only 20 microns, equivalent to one-third of the diameter of a human hair.

The picture shows our company's exhibition booth

During the exhibition, Lin Yingwu, Secretary of the Jiangmen Municipal Party Committee and Chairman of the Standing Committee of the Jiangmen Municipal People's Congress, and Feng Yining, Director of the Jiangmen Science and Technology Bureau, respectively inspected the Jiangmen exhibition projects, listened carefully to the product explanations at our booth, and had profound exchanges with our company leaders on the development of the enterprise.

The picture shows our general manager Qi Xiaolong (first from the left) explaining the situation of the enterprise to the city leaders

Our company has always adhered to independent research and development, actively innovating. This entrepreneurial spirit is highly in line with the founding theme of the High Tech Fair. This exhibition is our company's external exchange to the public, attracting investment oriented venture capital institutions and upstream and downstream enterprises' cooperation intentions, and has received certain attention and recognition from the outside world.