Packaging carrier board is an important basic material in the integrated circuit industry, used for carrying bare chips in integrated circuits, and is one of the most important development priorities in the field of copper-clad laminates in China. The carrier board for semiconductor packaging, as an advanced structure (polymer structure) and composite material, has been included in the new material technology field of the National 863 Program. At present, the domestic packaging carrier board market is still dominated by foreign brands. The industry monopoly pattern formed by industry giants such as Mitsubishi Gas and Lichang in Japan is still difficult to break in the short term. There are only one or two domestic packaging carrier board production enterprises, which are currently in a small batch state, and there are certain problems with product consistency and stability. The key to breaking the monopoly of foreign countries lies in the significant breakthrough of basic resin materials and formulations for semiconductor packaging.

Guangdong Yinghua has established a research and development center by integrating the resources and talent advantages of Tsinghua Pearl River Delta Research Institute, as well as Yinghua's existing technology and market advantages. The center is engaged in the research and development of key technologies, forward-looking technologies, and common technologies for semiconductor packaging basic materials, 5G communication materials, and new materials that integrate semiconductors and 5G, with the aim of significantly enhancing independent innovation capabilities and industrial competitiveness. Absorbing high-end outstanding talents, cultivating technological innovation talents, and promoting the transformation and application of major scientific and technological achievements.

The R&D center plans to cultivate and consolidate an innovative technology R&D team in the future. Within three years, we will conquer materials used for packaging advanced carrier boards such as BGA, PGA, BOC, CSP (CPU, GPU, AI processing, etc.), as well as materials for 5G communication. Within five years, develop a new type of carrier material that integrates 5G and semiconductor packaging.

The main purpose of establishing this research center is to continuously provide strong support for the structural upgrading of China's semiconductor materials industry, enhance the core competitiveness of the industry, and promote the leapfrog development of China's semiconductor industry.