Packaging carrier board is an important basic material in the integrated circuit industry, used for carrying bare chips in integrated circuits. The carrier board for semiconductor packaging, as an advanced structure (polymer structure) and composite material, has been included in the national 863 new material technology field. Widely applicable in CPU GPU、 In semiconductor electronic components such as flash memory and LED.

Since its establishment, Guangdong Yinghua has been committed to the research and development of semiconductor packaging carrier boards. In traditional fields, it has broken foreign monopolies and become an import substitute. In 2017, we successfully developed microprocessor chips and packaging carrier boards for next-generation display screens, synchronously developing and competing with international giants. Our key technical indicators have reached the world's advanced level, filling the gap in carrier boards for next-generation display screens and the integration of carrier boards and high-frequency high-speed in the field of 5G boards. Becoming internationally advanced and domestically leading.

The progressiveness of Guangdong Yinghua Packaging Board Project has been recognized by many fund companies, and has established long-term cooperation with Yueke Finance, Guanghua Venture Capital and Anfa Capital. We attach great importance to strategic cooperation with the three fund companies mentioned above, and will take the signing of this strategic cooperation agreement as an opportunity to further deepen practical cooperation and jointly create a new situation of friendly cooperation and mutual benefit. The investment of capital will drive Guangdong Yinghua to expand and strengthen its packaging carrier board project, and strive to become one of the leading international electronic material manufacturing suppliers.